US Patent 11966267 Thermo-electric cooling headsets

In one example in accordance with the present disclosure, a headset is described. The headset includes a sensory input device and a pad surrounding the sensory input device. The pad includes a thermo-electric cooling (TEC) device having a first side and a second side. The first side is to cool and the second side is to heat when a voltage is applied to the TEC device. The pad also includes a cooling layer in contact with the first side of the TEC device and a heat spreading layer in contact with the second side of the TEC device. The pad also includes an enclosing material enveloping the pad.