US Patent 11967060 Wafer level spatial signature grouping using transfer learning
Is a
Date Filed
August 17, 2021
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Date of Patent
April 23, 2024
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Patent Application Number
17405014
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Patent Inventor Names
Alán Dávila
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Osamu Yamamoto
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Narayani Narasimhan
0
Ski Sim
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P. Jithendra Kumar Reddy
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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