US Patent 11969816 Plated metal bonding method and plated metal bonding apparatus
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US Patent 11969816 Plated metal bonding method and plated metal bonding apparatus
Article
Patent abstract
A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultrasound vibration. The bonding processing unit performs the bonding processing using a plated material or otherwise using a metal portion in a state in which a plating material has been removed.
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Patent Number
Patent Inventor Names
Shigeru Sato0
Date of Patent
April 30, 2024
0Patent Application Number
169506150
Date Filed
November 17, 2020
0Patent Citations
Patent Primary Examiner
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