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US Patent 11969858 Substrate processing apparatus

Patent 11969858 was granted and assigned to Ebara Corporation on April, 2024 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Ebara Corporation

Current Assignee

Ebara Corporation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

119698580

Patent Inventor Names

Keisuke Namiki0

Makoto Fukushima0

Date of Patent

April 30, 2024

Patent Application Number

164995760

Date Filed

January 16, 2018

Patent Citations

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US Patent 9254545 Polishing apparatus, polishing pad, and polishing information management system

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US Patent 9073170 Polishing apparatus having thermal energy measuring means

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US Patent 9403256 Recording measurements by sensors for a carrier head

Patent Primary Examiner

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Patent abstract

A substrate processing apparatus includes a substrate polishing unit

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