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US Patent 11972977 Fabrication of rigid close-pitch interconnects

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
September 8, 2021
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Date of Patent
April 30, 2024
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Patent Application Number
17469116
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Patent Citations
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US Patent 9230809 Self-aligned double patterning
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US Patent 10170306 Method of double patterning lithography process using plurality of mandrels for integrated circuit applications
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US Patent 9953865 Structure and method to improve FAV RIE process margin and electromigration
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US Patent 11515203 Selective deposition of conductive cap for fully-aligned-via (FAV)
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US Patent 8247291 Methods of forming fine patterns in integrated circuit devices and methods of manufacturing integrated circuit devices including the same
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US Patent 9058997 Process of multiple exposures with spin castable films
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Patent Inventor Names
Kisik Choi
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Kenneth Chun Kuen Cheng
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Chanro Park
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Koichi Motoyama
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11972977
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Patent Primary Examiner
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Phuc T. Dang
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CPC Code
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H01L 23/5283
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H01L 21/76879
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