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US Patent 11972999 Unlanded thermal dissipation pillar adjacent active contact

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 7, 2021
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Date of Patent
April 30, 2024
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Patent Application Number
17643023
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Patent Citations
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US Patent 8461631 Composite contact for semiconductor device
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US Patent 10157788 Self-aligned interconnection for integrated circuits
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US Patent 7960827 Thermal via heat spreader package and method
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US Patent 9362198 Semiconductor devices with a thermally conductive layer and methods of their fabrication
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Patent Inventor Names
Rajendran Krishnasamy
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Mark D. Levy
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Michael J. Zierak
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Siva P. Adusumilli
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11972999
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Patent Primary Examiner
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Khaja Ahmad
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