A data center configured to be positioned in an environment (e.g., an open space) has a plurality of modules. Among other things, each module has a housing forming an interior configured to contain a plurality of processing devices that generate heat during operation. To manage the temperature within the interior, each module has an air inlet configured to receive air from the environment, and an air outlet configured to exhaust air from the housing. At least three of the modules are spaced apart to form at least one lateral space between adjacent modules. The plurality of modules preferably are arranged so that the at least three modules form an interior region configured to receive the exhaust air of the at least three modules.