US Patent 11974416 Intelligent thermosyphon system for datacenter cooling systems

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more flow controllers is associated with a cold plate and with a thermosyphon condenser that is elevated with respect to a cold plate so that two-phase fluid is enabled for gravity-assisted downflow in a liquid phase to a cold plate for absorption of heat and is enabled for buoyancy-driven upflow through a riser tube into a thermosyphon condenser for dissipation of heat of at least one computing device.