Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Huai-Ying Huang0
Yu-Ming Lin0
Date of Patent
April 30, 2024
0Patent Application Number
176683920
Date Filed
February 10, 2022
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
A semiconductor device includes a semiconductor substrate, ground level circuitry, a plurality of stacked memory arrays and a plurality of sense amplifier units. The ground level circuitry is disposed on the semiconductor substrate. The stacked memory arrays are disposed at an elevated level over the ground level circuitry. The sense amplifier units are disposed on the semiconductor substrate and electrically coupled to the stacked memory arrays, wherein at least a portion of each of the sense amplifier units is disposed at the elevated level over the ground level circuitry.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.