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US Patent 11979976 Methods of forming interconnect circuits
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Patent
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Date Filed
July 22, 2021
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Date of Patent
May 7, 2024
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Patent Application Number
17383129
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Patent Citations
US Patent 8510934 Method of manufacturing a flexible electronic product
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US Patent 8931166 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
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US Patent 8975510 Foil-based interconnect for rear-contact solar cells
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US Patent 9147875 Interconnect for battery packs
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US Patent 9214607 Wire bonded light emitting diode (LED) components including reflective layer
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US Patent 9466777 Systems and methods for combined thermal and electrical energy transfer
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US Patent 9671352 Reel-to-reel inspection apparatus and inspection method using the same
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US Patent 9692030 Battery module and method for the production thereof
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US Patent 6992001 Screen print under-bump metalization (UBM) to produce low cost flip chip substrate
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US Patent 7276724 Series interconnected optoelectronic device module assembly
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•••
Patent Inventor Names
Paul Henry Lego
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Kevin Michael Coakley
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Dongao Yang
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Malcolm Parker Brown
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Michael Lawrence Miller
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11979976
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Patent Primary Examiner
A. Dexter Tugbang
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CPC Code
H01M 50/519
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H05K 3/20
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H05K 3/281
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H05K 2203/06
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H05K 2203/065
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H05K 3/007
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H05K 3/0073
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H05K 3/06
0
H05K 3/4623
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H05K 3/44
0
•••
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