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US Patent 11984301 Edge ring, substrate support, substrate processing apparatus and method

Patent 11984301 was granted and assigned to Tokyo Electron on May, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Tokyo Electron
Tokyo Electron
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Current Assignee
Tokyo Electron
Tokyo Electron
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119843010
Patent Inventor Names
Takaaki Kikuchi0
Takashi Taira0
Date of Patent
May 14, 2024
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Patent Application Number
169419760
Date Filed
July 29, 2020
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Patent Citations
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US Patent 9349618 Substrate processing apparatus
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US Patent 10090161 Plasma etching apparatus and plasma etching method
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Patent Primary Examiner
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Ram N Kackar
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CPC Code
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H01L 21/67069
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H01L 21/3065
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H01L 21/6831
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H01L 21/6833
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H01L 21/68742
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B23Q 3/15
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H02N 13/00
0
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H01L 21/68735
0
...
Patent abstract

An edge ring includes a first edge ring, and a second edge ring that has a side surface adjacent to a side surface of the first edge ring and is movable in a vertical direction along the side surface of the first edge ring. Further, the side surface of the first edge ring and the side surface of the second edge ring at least partially face each other in a movement range of the second edge ring.

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