US Patent 11984376 Stacked semiconductor device including a cooling structure
Patent 11984376 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2024 by the United States Patent and Trademark Office.
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US Patent 11984376 Stacked semiconductor device including a cooling structure
A stacked semiconductor device includes a cooling structure to increase the cooling efficiency of the stacked semiconductor device. The cooling structure includes various types of cooling components integrated into the stacked semiconductor device that are configured to remove and/or dissipate heat from dies of the stacked semiconductor device. In this way, the cooling structure reduces device failures and permits the stacked semiconductor device to operate at greater voltages, greater speeds, and/or other increased performance parameters by removing and/or dissipating heat from the stacked semiconductor device.
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