Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11984385 Lead frame structure and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 14, 2021
0
Date of Patent
May 14, 2024
0
Patent Application Number
17230950
0
Patent Citations
‌
US Patent 10505090 Package including lead component having recess
0
‌
US Patent 8946875 Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems
0
‌
US Patent 8716730 LED module having a platform with a central recession
0
Patent Inventor Names
Chun-Hsiung Wang
0
Chin-Jui Yu
0
Jian-Tsai Chang
0
Wei-Chi Lin
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11984385
0
Patent Primary Examiner
‌
Samuel Park
0
CPC Code
‌
H01L 33/62
0
‌
H01L 33/58
0
‌
H01L 33/60
0
‌
H01L 2933/0033
0
‌
H01L 33/486
0
‌
H01L 23/49548
0
‌
H01L 2224/48247
0
‌
H01L 2224/48257
0
‌
H01L 2224/48091
0
‌
H01L 2933/0058
0
•••

Find more entities like US Patent 11984385 Lead frame structure and manufacturing method thereof

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo