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US Patent 11984443 Power distribution network

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
August 8, 2022
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Date of Patent
May 14, 2024
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
17818053
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Patent Citations
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US Patent 11296070 Integrated circuit with backside power rail and backside interconnect
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US Patent 8507957 Integrated circuit layouts with power rails under bottom metal layer
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Patent Inventor Names
Jiann-Tyng Tzeng
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Wei-Cheng Lin
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Kam-Tou Sio
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11984443
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Patent Primary Examiner
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Thinh T Nguyen
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CPC Code
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H01L 2027/11887
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H01L 2027/11866
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H01L 2027/11861
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H01L 27/12
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H01L 21/84
0
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H01L 27/0207
0

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