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US Patent 11985795 Temperature control unit
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Patent
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Date Filed
May 14, 2020
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Date of Patent
May 14, 2024
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Patent Application Number
17595069
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Patent Citations
US Patent 11419246 Cooling electronic devices in a data center
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US Patent 11343945 Combined liquid and air cooling system for fail-safe operation of high power density ASIC devices
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US Patent 11346617 Wick structure and heat pipe accommodating wick structure
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US Patent 9009971 Wicking and coupling element(s) facilitating evaporative cooling of component(s)
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US Patent 9095942 Wicking and coupling element(s) facilitating evaporative cooling of component(s)
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US Patent 10739830 Electronic device including vapor (two phase) chamber for absorbing heat
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US Patent 10838287 Cooling device and projector
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US Patent 11337336 Cooling device
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Patent Inventor Names
Hideki Moriuchi
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Shuhei Hatano
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11985795
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Patent Primary Examiner
Adrian S Wilson
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CPC Code
H05K 7/20254
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H05K 7/20472
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H05K 7/20272
0
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