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US Patent 11988453 Thermal management planes

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
February 7, 2022
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Date of Patent
May 21, 2024
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Patent Application Number
17666537
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Patent Citations
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US Patent 7069978 Chemically compatible, lightweight heat pipe
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US Patent 9909814 Flexible thermal ground plane and manufacturing the same
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US Patent 9921004 Polymer-based microfabricated thermal ground plane
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US Patent 10066876 Vapor chamber heat flux rectifier and thermal switch
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US Patent 10281220 Heat sink with vapor chamber
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US Patent 10458719 High performance two-phase cooling apparatus
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US Patent 10527358 Thermal ground plane
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US Patent 10544994 Sheet-shaped heat pipe
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US Patent 10571200 Thermal ground plane
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US Patent 10973151 Vapor chamber
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•••
Patent Inventor Names
Ryan J. Lewis
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Ronggui Yang
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Yung-Cheng Lee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11988453
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Patent Primary Examiner
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Lionel Nouketcha
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CPC Code
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H01L 23/427
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F28D 2015/0225
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F28D 15/046
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F28D 15/0241
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F28D 15/0283
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F28D 15/0233
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H05K 7/20336
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F28D 15/04
0

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