Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tiexuan Wang0
Sam Mahin Shirazi0
Yong Gang Li0
Eric T. Chiang0
Henry H. Yang0
Matthew Burke0
Date of Patent
May 21, 2024
0Patent Application Number
176627150
Date Filed
May 10, 2022
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
