US Patent 11991819 Microstrip delay matching using printed dielectric material

A printed circuit board includes a first and second microstrip circuit traces formed on an outer surface of the printed circuit board, and a patterned dielectric material applied over a first length of the first microstrip circuit trace. The first microstrip circuit trace has a first length and carries a first signal. The second microstrip circuit trace is adjacent to the first microstrip circuit trace, has a second length longer than the first length, and carries a second signal. The patterned dielectric material is provided over a portion of the first length to delay the first signal relative to the second signal.