Disclosed herein is a system for slurry coating leveling. The system includes a guide frame and a scrapper apparatus coupled to the guide frame. The scrapper apparatus includes a plurality of scrapper fingers aligned substantially parallel to each other. The system also includes a contour guide coupled to the scrapper fingers. The contour guide is configured to guide movement of the scrapper fingers across a surface of a component having a slurry coating. The scrapper fingers conform to a contour profile of the surface to level the slurry coating on the surface of the component.