US Patent 11992900 Methods to fabricate chamber component holes using laser drilling
Patent 11992900 was granted and assigned to Applied Materials on May, 2024 by the United States Patent and Trademark Office.
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US Patent 11992900 Methods to fabricate chamber component holes using laser drilling
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Patent abstract
Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sumit Agarwal0
Timothy Joseph Franklin0
Date of Patent
May 28, 2024
0Patent Application Number
170907700
Date Filed
November 5, 2020
0Patent Citations
Patent Primary Examiner
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