US Patent 11993445 Insulation panel
Patent 11993445 was granted and assigned to Temperpack Technologies Inc. on May, 2024 by the United States Patent and Trademark Office.
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US Patent 11993445 Insulation panel
Article
Patent abstract
An insulation panel has an insulation core layer disposed that includes at least a first particulate and a second particulate of a plurality of discrete puffed polysaccharide particulates that defines a plurality of voids within the core layer. The first particulate is at least partially adhered to at least the second particulate at one or more bonded areas without the use of external non-water-soluble adhesives.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Charles-Alexandre Vincent0
James McGoff0
Date of Patent
May 28, 2024
0Patent Application Number
170682120
Date Filed
October 12, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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