Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zhu Chen0
Date of Patent
May 28, 2024
0Patent Application Number
170008600
Date Filed
August 24, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
An adhesive floor/wallboard includes a floor/wallboard main body layer and a buffer layer adhered to the back surface of the floor/wallboard main body layer. The buffer layer is provided with a plurality of holes. The holes extend through the buffer layer to the main body layer. Glue is deposited in the holes. The buffer layer is adhered to the back surface of the floor/wallboard. The glue in the holes makes direct contact with the floor/wallboard main body at the holes. Due to the holes and their depth, the contact area between the glue, the buffer layer and the main body is increased. Accordingly, the adhesive floor/wallboard can be more firmly adhered to a backing surface.
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