Patent attributes
The present disclosure relates to an inverter module which can be coupled to another inverter module, the inverter module comprising: a main PCB having a main substrate on which a plurality of circuits are printed; a plurality of sub-PCBs coupled to the main PCB and each having one end exposed through the main PCB; and a case for receiving the main PCB and the sub-PCBs, wherein when the inverter module is coupled to another inverter module, the ends of the sub-PCBs exposed to the outside of the case are coupled to the another adjacent inverter module. According to the present disclosure, a plurality of inverter modules can be connected and used as one inverter system, and thus an inverter system having a required capacity can be easily implemented.
