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US Patent 11999001 Advanced device assembly structures and methods
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Patent
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Date Filed
December 8, 2021
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Date of Patent
June 4, 2024
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Patent Application Number
17545322
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Patent Citations
US Patent 8240545 Methods for minimizing component shift during soldering
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US Patent 9024205 Advanced device assembly structures and methods
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US Patent 7060601 Packaging substrates for integrated circuits and soldering methods
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US Patent 7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
0
US Patent 7777233 Device containing non-blinking quantum dots
0
US Patent 7919342 Patterned inorganic LED device
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US Patent 7009299 Kinetically controlled solder
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Patent Inventor Names
Cyprian Emeka Uzoh
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11999001
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Patent Primary Examiner
Ishwarbhai B. Patel
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CPC Code
H01L 24/98
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H01L 21/4853
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H01L 21/76898
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H01L 24/02
0
H01L 24/03
0
H01L 24/05
0
H01L 24/11
0
H01L 24/27
0
H01L 2224/02372
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H01L 2224/03912
0
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