Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wu Hu Li0
Olaf Hohlfeld0
Ivan Nikitin0
Martin Mayer0
Raphael Hellwig0
Date of Patent
June 4, 2024
0Patent Application Number
178423020
Date Filed
June 16, 2022
0Patent Primary Examiner
Patent abstract
A power semiconductor module includes a substrate of planar sheet metal including a plurality of islands that are each defined by channels that extend between upper and lower surfaces of the substrate, a first semiconductor die mounted on a first one of the islands, a molded body of encapsulant that covers the metal substrate, fills the channels, and encapsulates the first semiconductor die, a hole in the molded body that extends to a recess in the upper surface of the substrate, and a press-fit connector arranged in the hole such an interior end of the press-fit connector is mechanically and electrically connected to the substrate.
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