US Patent 12004320 Thermal component and electronic device

A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.