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US Patent 12009343 Stackable package and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
November 9, 2016
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Date of Patent
June 11, 2024
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Patent Application Number
15347545
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Patent Citations
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US Patent 7960827 Thermal via heat spreader package and method
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US Patent 8183696 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
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US Patent 8300423 Stackable treated via package and method
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US Patent 8341835 Buildup dielectric layer having metallization pattern semiconductor package fabrication method
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US Patent 8482134 Stackable package and method
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US Patent 8525318 Semiconductor device and fabricating method thereof
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US Patent 9496210 Stackable package and method
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US Patent 6838776 Circuit device with at least partial packaging and method for forming
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US Patent 6888240 High performance, low cost microelectronic circuit package with interposer
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US Patent 6919514 Structure having laser ablated features and method of fabricating
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•••
Patent Inventor Names
Roger D. St. Amand
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Robert Francis Darveaux
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Vladimir Perelman
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12009343
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Patent Primary Examiner
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Shaun M Campbell
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