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US Patent 12016119 Method for manufacturing multilayer printed circuit board

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 6, 2021
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Date of Patent
June 18, 2024
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Patent Application Number
17542706
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Patent Citations
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US Patent 8021748 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same
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US Patent 8069560 Method of manufacturing multilayer wiring board
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Patent Inventor Names
Cheng-Jia Li
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Mei Yang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12016119
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Patent Primary Examiner
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Thiem D Phan
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CPC Code
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H05K 1/09
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H05K 1/0298
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H05K 2201/0338
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H05K 3/4644
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Y10T 29/49126
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H05K 3/108
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H05K 3/0097
0
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H05K 1/144
0

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