Patent attributes
A PIC comprising an optical edge coupler having a plurality of optical cores within a heterogeneous stack of dielectric layers providing an optical cladding for the optical cores. The layer stack comprises first and second groups of layers, wherein refraction-index differences between individual layers of the same group are much smaller than refraction-index differences between any two layers from different groups. The optical cores are arranged in a plurality of parallel planar arrays enabling a large MFD change. At least one of the arrays is located within the first group of layers, and at least another one of the arrays is located within the second group of layers. End sections of the optical cores are adjacent to an edge of the PIC and may be optically coupled to an external optical fiber or on-chip waveguide of another PIC for a low-loss transfer of optical power therebetween.
