US Patent 12021060 Reducing keep-out-zone area for a semiconductor device
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US Patent 12021060 Reducing keep-out-zone area for a semiconductor device
Article
Patent abstract
A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.
Infobox
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Patent Jurisdiction
Patent Number
Patent Inventor Names
Alex Zhang0
Hope Chiu0
Kevin Du0
Paul Qu0
Rui Yuan0
Shixing Zhu0
Vincent Jiang0
Yi Su0
Zengyu Zhou0
Date of Patent
June 25, 2024
0Patent Application Number
170284840
Date Filed
September 22, 2020
0Patent Citations
Patent Primary Examiner
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