Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pavel Mamyshev0
Date of Patent
July 2, 2024
0Patent Application Number
177633810
Date Filed
September 24, 2020
0Patent Citations
Patent Primary Examiner
Patent abstract
A method and system for an optical package assembly is disclosed. According to one example, the optical package assembly includes a photonic integrated circuit (PIC) chip, at least one fiber coupled to the PIC chip, a fiber lid plate disposed on at least a portion of the at least one fiber, and a cover plate having a surface coupled to the PIC chip and the fiber lid plate.
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