US Patent 12028006 Power module and motor drive system using the same

An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.