Patent attributes
A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body. The device further comprises a plurality of removable arms each comprising a first and second end, each of the plurality of arms being configured to mate with the body at a respective one of the plurality of first engaging features, wherein each of the first ends defines a second engaging feature dimensioned to cooperate and form an engagement with a respective first engaging feature, and wherein each of the second ends is configured to effect an operative fixing of the device to a supporting surface through application of a force on each of the second ends, the force being perpendicular to the supporting surface.