US Patent 12066486 Semiconductor wafer and multi-chip parallel testing method

A semiconductor wafer and a multi-chip parallel testing method are provided. The semiconductor wafer includes a plurality of chips, a plurality of test pads, and a test control circuit. The test pads receive a plurality of test signals from a test fixture. The test control circuit is electrically connected to the chips and the test pads, selects at least one selected test signal from the test signals, generates a plurality of broadcast test signals according to the at least one selected test signal, and provides the broadcast test signals to the chips in parallel.