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US Patent 12068252 Hybrid conductive structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 28, 2022
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Date of Patent
August 20, 2024
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Patent Application Number
17875675
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Patent Citations
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US Patent 10867851 Contact structure and semiconductor device and method of forming the same
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US Patent 11282749 Forming nitrogen-containing low-k gate spacer
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US Patent 10553481 Vias for cobalt-based interconnects and methods of fabrication thereof
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US Patent 11024550 Semiconductor device and method
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Patent Inventor Names
Cheng-Wei Chang
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Chia-Hung Chu
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Hsu-Kai Chang
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Yi-Ying Liu
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Shuen-Shin Liang
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Shu-Lan Chang
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Sung-Li Wang
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Chien-Shun Liao
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12068252
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Patent Primary Examiner
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Jaehwan Oh
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CPC Code
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H01L 29/665
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H01L 29/0847
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H01L 23/53266
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H01L 23/5226
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H01L 21/76883
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H01L 21/76816
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H01L 21/7684
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H01L 21/823431
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H01L 21/76897
0

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