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US Patent 12069834 Heat dissipation system and electronic device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 14, 2022
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Date of Patent
August 20, 2024
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Patent Application Number
17839704
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Patent Citations
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US Patent 11839053 Fluid collecting apparatus, cooling system and method of operating the same
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US Patent 9812377 Semiconductor module and inverter device
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US Patent 10416736 Computer system with cooled electric power supply unit
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US Patent 7000684 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
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US Patent 7133286 Method and apparatus for sealing a liquid cooled electronic device
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US Patent 8059405 Condenser block structures with cavities facilitating vapor condensation cooling of coolant
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US Patent 8953320 Coolant drip facilitating partial immersion-cooling of electronic components
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US Patent 9009971 Wicking and coupling element(s) facilitating evaporative cooling of component(s)
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US Patent 9095942 Wicking and coupling element(s) facilitating evaporative cooling of component(s)
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Patent Inventor Names
Hung-Ju Chen
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Kai-Yang Tung
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12069834
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Patent Primary Examiner
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Anatoly Vortman
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CPC Code
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H05K 7/203
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H05K 7/20318
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H05K 7/20818
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H05K 7/20327
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