Golden has been acquired by ComplyAdvantage.Read about it here ⟶

‌

US Patent 12070797 Direct metal deposition of electronic device components

Patent 12070797 was granted and assigned to Apple (company) on August, 2024 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

0

Patent attributes

Patent Applicant

Apple (company)

0

Current Assignee

Apple (company)

0

Patent Jurisdiction

United States Patent and Trademark Office

0

Patent Number

Patent Inventor Names

Adam T. Clavelle0

James A. Yurko0

Abhijeet Misra0

Brian M. Gable0

Isabel Yang0

Eric W. Hamann0

Anthony D. Prescenzi0

Date of Patent

August 27, 2024

0

Patent Application Number

174477900

Date Filed

September 15, 2021

0

Patent Citations

US Patent 10090877 Housing for encasing a mobile computing device

0

US Patent 7139633 Method of fabricating composite tooling using closed-loop direct-metal deposition

0

US Patent 8617661 Systems and methods for fabricating a direct metal deposition structure having fully forged structural qualities

0

US Patent 10478897 Sheet metal system and manufacturing process joining incremental forming and direct metal deposition

0

Patent Primary Examiner

0

CPC Code

0

0

Patent abstract

A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 12070797 Direct metal deposition of electronic device components

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Golden Query Tool