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US Patent 12074116 Integrated package structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 25, 2020
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Date of Patent
August 27, 2024
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Patent Application Number
17613057
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Patent Citations
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US Patent 11610847 Laser-based redistribution and multi-stacked packages
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US Patent 11557579 Microelectronic assemblies having an integrated capacitor
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US Patent 11862572 Laser-based redistribution and multi-stacked packages
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US Patent 10535608 Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
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US Patent 11342305 Microelectronic assemblies with communication networks
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Patent Inventor Names
Xueqing Chen
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Shuo Liu
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Yaojian Lin
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Shasha Zhou
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Haitao Shi
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Jian Chen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12074116
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Patent Primary Examiner
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Nicholas J Tobergte
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CPC Code
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H01L 23/49822
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H01L 23/3107
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