Patent attributes
An electronic apparatus includes: a hard substrate having a first surface with a first wiring layer terminal, a second surface positioned on a back side of the first surface, and an end surface having a second wiring layer terminal and being continuous with the first surface and the second surface; and a flexible substrate having a third surface with a third wiring layer terminal and opposing the first surface of the hard substrate, and a fourth surface having a fourth wiring layer terminal and positioned on a back side of the third surface. The first wiring layer terminal and the fourth wiring layer terminal are electrically connected by solder. The second wiring layer terminal and the third wiring layer terminal are electrically connected by solder.