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US Patent 12075587 Heat transfer interfaces for circuit card assembly (CCA) modules

Patent 12075587 was granted and assigned to Hamilton Sundstrand on August, 2024 by the United States Patent and Trademark Office.

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Patent abstract

An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.

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