Patent attributes
A heat dissipation device includes a housing, a heat dissipation plate, a first fan and at least two second fans. The housing has a first sidewall and a second sidewall that are opposite to each other. The first sidewall has a first opening area and the second sidewall has a second opening area which is facing the first opening area. The heat dissipation plate is located inside the housing and covers at least one heat source. An opening that corresponds to the first opening area and contains the first fan penetrates through the heat dissipation plate. Each of the at least two second fans that include airflow exits facing away from the first fan is located nearby the heat dissipation plate. The housing includes side surfaces that connect the first sidewall and the second sidewall and have three side opening areas that are facing different directions.
