US Patent 12076965 Topology optimized high interface packing structures
Patent 12076965 was granted and assigned to modumetal, inc. on September, 2024 by the United States Patent and Trademark Office.
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US Patent 12076965 Topology optimized high interface packing structures
Article
Patent abstract
The present disclosure provides articles comprising a laminate material having a void volume of at least 40%, having a lattice structure comprising a plurality of interconnected struts forming polyhedrons in a series that extends in three dimensions, or both, where the laminate materials have an interface density of at least 2.0 interfaces/micrometer (μm). Also described are methods for forming the same.
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Current Assignee
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Patent Inventor Names
Christina A. Lomasney0
Date of Patent
September 3, 2024
0Patent Application Number
163468430
Date Filed
November 2, 2017
0Patent Citations
Patent Primary Examiner
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