Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shawna M. Liff0
Adel A. Elsherbini0
Amr Elshazly0
Arun Chandrasekhar0
Johanna M. Swan0
Date of Patent
September 3, 2024
0Patent Application Number
182161020
Date Filed
June 29, 2023
0Patent Citations
Patent Primary Examiner
Patent abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
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