Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsin-Hua Hu0
Andreas Bibl0
John A. Higginson0
Date of Patent
September 3, 2024
0Patent Application Number
184941090
Date Filed
October 25, 2023
0Patent Citations
0
0
...
Patent Primary Examiner
Patent abstract
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
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