Patent 12082369 was granted and assigned to Mitsubishi Electric Corporation on September, 2024 by the United States Patent and Trademark Office.
A heat sink includes a main body and multiple circular pipes. The main body is in contact with at least one heat emitter. The circular pipes are disposed inside the main body. The circular pipes extend in a shape of helices and are configured to convey refrigerant. The circular pipes are arranged such that the central axes of the helices are adjacent. Each two of the circular pipes of which the central axes of the helices are adjacent to each other are intertwined with each other.