US Patent 12083596 Thermal elements for disassembly of node-based adhesively bonded structures

Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adhesive interfaces, the joint comprising an adhesive bonding to the first adhesive interface and to the second adhesive interface, such that the first component and the second component are joined together, and at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element.