US Patent 12086666 Layered structures with cutting lines
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US Patent 12086666 Layered structures with cutting lines
Article
Patent abstract
The invention is related to a layered structure with at least one layer a. of a material with a VST≥85° C. comprising at least one cutting line b. reaching through the whole thickness of the layered structure surrounding at least one first portion which is extractable and reinsertable manually from the layered structure as well as a production process for such a layered structure.
Infobox
Is a
Patent Jurisdiction
Patent Number
Patent Inventor Names
Christoph Koehler0
Daopeng Wang0
Georgios Tziovaras0
Heinz Pudleiner0
Kira Planken0
Meng Feng0
Roland Kuenzel0
Stefan Janke0
Yizhe Zhao0
Date of Patent
September 10, 2024
0Patent Application Number
177814870
Date Filed
December 10, 2020
0Patent Citations
Patent Primary Examiner
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