Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenneth Chun Kuen Cheng0
Chanro Park0
Koichi Motoyama0
Chih-Chao Yang0
Date of Patent
September 10, 2024
0Patent Application Number
174811980
Date Filed
September 21, 2021
0Patent Citations
...
Patent Primary Examiner
Patent abstract
A dielectric layer is located on top of and in contact with a substrate. A conductive line located within the dialectic layer. A barrier layer on top of an in contact with the dielectric layer. The barrier layer is below the conductive line. A liner layer on top of and in contact with the barrier layer and below and in contact with the conductive line. A metal liner on top of and in contact with the conductive line. A capping layer on top of and in contact with the dielectric layer, the barrier layer, the liner layer, and the metal liner.
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