Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 12087656 Package architecture utilizing wafer to wafer bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 19, 2023
0
Date of Patent
September 10, 2024
0
Patent Application Number
18303152
0
Patent Citations
‌
US Patent 8421217 Achieving mechanical and thermal stability in a multi-chip package
0
‌
US Patent 10199302 Molded air cavity packages and methods for the production thereof
0
‌
US Patent 9595506 Packages with thermal management features for reduced thermal crosstalk and methods of forming same
0
‌
US Patent 11637050 Package architecture utilizing wafer to wafer bonding
0
‌
US Patent 7031162 Method and structure for cooling a dual chip module with one high power chip
0
‌
US Patent 8202765 Achieving mechanical and thermal stability in a multi-chip package
0
Patent Inventor Names
Anthony Chiu
0
Mihir Roy
0
Robert Charles Dry
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
12087656
0
Patent Primary Examiner
‌
Telly D Green
0

Find more entities like US Patent 12087656 Package architecture utilizing wafer to wafer bonding

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo