US Patent 12087834 Semiconductor structure
Patent 12087834 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2024 by the United States Patent and Trademark Office.
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US Patent 12087834 Semiconductor structure
Article
Patent abstract
A semiconductor structure is provided. The semiconductor structure includes a gate structure, a source/drain structure, a barrier layer, and a glue layer. The gate structure is over a fin structure. The source/drain structure is in the fin structure and adjacent to the gate structure. The barrier layer is over the source/drain structure. The glue layer is adjacent to the barrier layer. The glue layer has an extending portion in direct contact with the gate structure.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Hui Lin0
Chung-Ting Ko0
Hong-Hsien Ke0
Shih-Wen Huang0
Tai-Chun Huang0
Date of Patent
September 10, 2024
0Patent Application Number
176869780
Date Filed
March 4, 2022
0Patent Citations
0
Patent Primary Examiner
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